Ryzen 7 8745HX vs Ryzen AI 9 HX PRO 370

Performance Spectrum - CPU

About PassMark

PassMark CPU Mark evaluates processor speed through complex mathematical computations. It provides a reliable metric to compare multi-core performance, where higher scores indicate faster processing for multitasking, gaming, and heavy workloads.

Performance Comparison

About PassMark

Passmark Score

32620

Passmark Score

32841

Performance Difference

Ryzen AI 9 HX PRO 370 is 0.7% faster than Ryzen 7 8745HX

Benchmarks & Performance Comparison

In this CPU comparison, Ryzen AI 9 HX PRO 370 performs 0.7% better in benchmarks. Below you'll find detailed performance analysis, gaming benchmarks, power consumption data, and specifications to help you decide between Ryzen 7 8745HX and Ryzen AI 9 HX PRO 370.

Both processors are popular choices for gaming PCs. Consider factors like core count, boost clock speeds, power consumption (TDP), and gaming vs productivity performance when choosing between these CPUs.

Technical Specifications

Detailed hardware specifications for Ryzen 7 8745HX and Ryzen AI 9 HX PRO 370

AMD

Ryzen 7 8745HX

The Ryzen 7 8745HX is manufactured by AMD. It was released in 23 April 2025 (less than a year ago). It is based on the Dragon Range (2025) architecture. It features 8 cores and 16 threads. Base frequency is 3.6 GHz, with boost up to 5.1 GHz. L3 cache: 32 MB (total). L2 cache: 1 MB (per core). Built on 5 nm process technology. Socket: FL1. Thermal design power (TDP): 55 Watt. Memory support: DDR5. Passmark benchmark score: 32,620 points.

General Information

Type:Para notebooks
Designer:AMD
Manufacturer:TSMC
Release Date:23 April 2025 (less than a year ago)
Architecture Codename:Dragon Range (2025)
Performance Ranking Position:375

Technical Specifications

Cores:8
Threads:16
Die Size:71 mm2
L1 Cache:64 kB (per core)
L2 Cache:1 MB (per core)
L3 Cache:32 MB (total)
Max Frequency:5.1 GHz
64-Bit Support:+
Base Frequency:3.6 GHz
Transistor Count:6,570 million
Process Technology:5 nm
Unlocked Multiplier:+

Compatibility

Socket:FL1
Power Consumption (TDP):55 Watt
Max Processors In Config:1

Memory

RAM Types:DDR5
AMD

Ryzen AI 9 HX PRO 370

The Ryzen AI 9 HX PRO 370 is manufactured by AMD. It was released in 6 January 2025 (less than a year ago). It is based on the Strix Point-HX PRO (Zen 5/5c) (2025) architecture. It features 12 cores and 24 threads. Base frequency is 2 GHz, with boost up to 5.1 GHz. L3 cache: 16 MB. L2 cache: 1 MB (per core). Built on 4 nm process technology. Socket: FP8. Thermal design power (TDP): 28 Watt. Memory support: DDR5. Passmark benchmark score: 32,841 points.

General Information

Type:Para notebooks
Series:Strix Point (Zen 5/5c, Ryzen AI 3/5/7/9)
Designer:AMD
Manufacturer:TSMC
Release Date:6 January 2025 (less than a year ago)
Architecture Codename:Strix Point-HX PRO (Zen 5/5c) (2025)
Performance Ranking Position:372

Technical Specifications

Cores:12
Threads:24
Die Size:233 mm2
L1 Cache:80 kB (per core)
L2 Cache:1 MB (per core)
L3 Cache:16 MB
Max Frequency:5.1 GHz
64-Bit Support:-
Base Frequency:2 GHz
Process Technology:4 nm
Velocidade Dos Pneus:54 MHz

Compatibility

Socket:FP8
Power Consumption (TDP):28 Watt
Max Processors In Config:1

Memory

RAM Types:DDR5

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