Core i5-13400F vs Mobile Sempron 3300+

PassMark CPU Mark evaluates processor speed through complex mathematical computations. It provides a reliable metric to compare multi-core performance, where higher scores indicate faster processing for multitasking, gaming, and heavy workloads.

Performance Comparison

About PassMark

Passmark Score

25029

Passmark Score

376

Performance Difference

Core i5-13400F is 6556.6% faster than Mobile Sempron 3300+

Benchmarks & Performance Comparison

In this CPU comparison, Core i5-13400F performs 6556.6% better in benchmarks. Below you'll find detailed performance analysis, gaming benchmarks, power consumption data, and specifications to help you decide between Core i5-13400F and Mobile Sempron 3300+.

Both processors are popular choices for gaming PCs. Consider factors like core count, boost clock speeds, power consumption (TDP), and gaming vs productivity performance when choosing between these CPUs.

Technical Specifications

Detailed hardware specifications for Core i5-13400F and Mobile Sempron 3300+

Core i5-13400F

The Core i5-13400F is manufactured by Intel. It was released in 4 January 2023 (2 years ago). It is based on the Raptor Lake-S (2023−2024) architecture. It features 10 cores and 16 threads. Base frequency is 2.5 GHz, with boost up to 4.6 GHz. L3 cache: 20 MB (total). L2 cache: 1.25 MB (per core). Built on Intel 7 nm process technology. Socket: LGA1700. Thermal design power (TDP): 65 Watt. Memory support: DDR5, DDR4. Passmark benchmark score: 25,029 points. Launch price was $196.

General Information

Type:desktop

Designer:Intel

Launch Price:$196

Manufacturer:Intel

Release Date:4 January 2023 (2 years ago)

Architecture Codename:Raptor Lake-S (2023−2024)

Performance Ranking Position:567

Technical Specifications

Cores:10

Threads:16

Die Size:257 mm2

L1 Cache:80K (per core)

L2 Cache:1.25 MB (per core)

L3 Cache:20 MB (total)

Max Frequency:4.6 GHz

64-Bit Support:+

Base Frequency:2.5 GHz

Cores Eficientes:4

Process Technology:Intel 7 nm

Cores De Desempenho:6

Max Core Temperature:100 °C

Max Case Temperature (TCase):72 °C

Compatibilidade Com Windows 11:+

Compatibility

Socket:LGA1700

Power Consumption (TDP):65 Watt

Max Processors In Config:1

Memory

RAM Types:DDR5, DDR4

Memory Channels:2

Memory Bandwidth:76.8 GB/s

Max Memory Capacity:192 GB

Mobile Sempron 3300+

The Mobile Sempron 3300+ is manufactured by AMD. It was released in 1 June 2005 (20 years ago). It is based on the Roma (2005) architecture. It features 1 cores and 1 threads. Max frequency: 2 GHz. L2 cache: 128 kB. Built on 90 nm process technology. Socket: 745. Thermal design power (TDP): 128 kB. Passmark benchmark score: 376 points.