Xeon Gold 6338T vs Ryzen AI 9 HX 370

Performance Spectrum - CPU

About PassMark

PassMark CPU Mark evaluates processor speed through complex mathematical computations. It provides a reliable metric to compare multi-core performance, where higher scores indicate faster processing for multitasking, gaming, and heavy workloads.

Performance Comparison

About PassMark

Passmark Score

35801

Passmark Score

35133

Performance Difference

Xeon Gold 6338T is 1.9% faster than Ryzen AI 9 HX 370

Benchmarks & Performance Comparison

In this CPU comparison, Xeon Gold 6338T performs 1.9% better in benchmarks. Below you'll find detailed performance analysis, gaming benchmarks, power consumption data, and specifications to help you decide between Xeon Gold 6338T and Ryzen AI 9 HX 370.

Both processors are popular choices for gaming PCs. Consider factors like core count, boost clock speeds, power consumption (TDP), and gaming vs productivity performance when choosing between these CPUs.

Technical Specifications

Detailed hardware specifications for Xeon Gold 6338T and Ryzen AI 9 HX 370

Intel

Xeon Gold 6338T

The Xeon Gold 6338T is manufactured by Intel. It was released in 6 April 2021 (4 years ago). It is based on the Ice Lake-SP (2021) architecture. It features 24 cores and 48 threads. Base frequency is 2.1 GHz, with boost up to 3.4 GHz. L3 cache: 36 MB (total). L2 cache: 1 MB (per core). Built on 10 nm process technology. Socket: LGA4189. Thermal design power (TDP): 165 Watt. Memory support: DDR4-3200. Passmark benchmark score: 35,801 points.

General Information

Type:server
Designer:Intel
Manufacturer:Intel
Release Date:6 April 2021 (4 years ago)
Architecture Codename:Ice Lake-SP (2021)
Performance Ranking Position:335

Technical Specifications

Cores:24
Threads:48
L1 Cache:64K (per core)
L2 Cache:1 MB (per core)
L3 Cache:36 MB (total)
Max Frequency:3.4 GHz
64-Bit Support:+
Base Frequency:2.1 GHz
Process Technology:10 nm
Max Case Temperature (TCase):87 °C
Compatibilidade Com Windows 11:+

Compatibility

Socket:LGA4189
Power Consumption (TDP):165 Watt
Max Processors In Config:2

Memory

RAM Types:DDR4-3200
Memory Channels:8
ECC Memory Support:+
Max Memory Capacity:6 TB
AMD

Ryzen AI 9 HX 370

The Ryzen AI 9 HX 370 is manufactured by AMD. It was released in Julho 2024 (1 year ago). It is based on the Strix Point (2024−2025) architecture. It features 12 cores and 24 threads. Base frequency is 2 GHz, with boost up to 5.1 GHz. L3 cache: 24 MB (total). L2 cache: 1 MB (per core). Built on 4 nm process technology. Socket: FP8. Thermal design power (TDP): 28 Watt. Memory support: DDR5. Passmark benchmark score: 35,133 points.

General Information

Type:Para notebooks
Designer:AMD
Manufacturer:TSMC
Release Date:Julho 2024 (1 year ago)
Architecture Codename:Strix Point (2024−2025)
Performance Ranking Position:341

Technical Specifications

Cores:12
Threads:24
Die Size:233 mm2
L1 Cache:80 kB (per core)
L2 Cache:1 MB (per core)
L3 Cache:24 MB (total)
Max Frequency:5.1 GHz
64-Bit Support:+
Base Frequency:2 GHz
Process Technology:4 nm
Max Core Temperature:100 °C
Velocidade Dos Pneus:54 MHz

Compatibility

Socket:FP8
Power Consumption (TDP):28 Watt
Max Processors In Config:1

Memory

RAM Types:DDR5

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