Ryzen 9 3900X vs Ryzen AI 9 HX PRO 370

PassMark CPU Mark evaluates processor speed through complex mathematical computations. It provides a reliable metric to compare multi-core performance, where higher scores indicate faster processing for multitasking, gaming, and heavy workloads.

Performance Comparison

About PassMark

Passmark Score

32517

Passmark Score

32841

Performance Difference

Ryzen AI 9 HX PRO 370 is 1.0% faster than Ryzen 9 3900X

Benchmarks & Performance Comparison

In this CPU comparison, Ryzen AI 9 HX PRO 370 performs 1.0% better in benchmarks. Below you'll find detailed performance analysis, gaming benchmarks, power consumption data, and specifications to help you decide between Ryzen 9 3900X and Ryzen AI 9 HX PRO 370.

Both processors are popular choices for gaming PCs. Consider factors like core count, boost clock speeds, power consumption (TDP), and gaming vs productivity performance when choosing between these CPUs.

Technical Specifications

Detailed hardware specifications for Ryzen 9 3900X and Ryzen AI 9 HX PRO 370

Ryzen 9 3900X

The Ryzen 9 3900X is manufactured by AMD. It was released in 7 July 2019 (6 years ago). It is based on the Matisse (Zen 2) (2019−2020) architecture. It features 12 cores and 24 threads. Base frequency is 3.8 GHz, with boost up to 4.6 GHz. L3 cache: 64 MB. L2 cache: 512K (per core). Built on 7 nm, 12 nm process technology. Socket: AM4. Thermal design power (TDP): 125 Watt. Memory support: DDR4 Dual-channel. Passmark benchmark score: 32,517 points. Launch price was $499.

General Information

Type:desktop

Series:AMD Ryzen 9

Designer:AMD

Launch Price:$499

Manufacturer:TSMC

Release Date:7 July 2019 (6 years ago)

Architecture Codename:Matisse (Zen 2) (2019−2020)

Performance Ranking Position:378

Technical Specifications

Cores:12

Threads:24

L1 Cache:96K (per core)

L2 Cache:512K (per core)

L3 Cache:64 MB

Max Frequency:4.6 GHz

64-Bit Support:+

Base Frequency:3.8 GHz

Transistor Count:19,200 million

Process Technology:7 nm, 12 nm

Unlocked Multiplier:+

Max Core Temperature:95 °C

Compatibilidade Com Windows 11:+

Compatibility

Socket:AM4

Power Consumption (TDP):125 Watt

Max Processors In Config:1 (Uniprocessor)

Memory

RAM Types:DDR4 Dual-channel

Memory Channels:2

Memory Bandwidth:51.196 GB/s

Max Memory Capacity:128 GB

Ryzen AI 9 HX PRO 370

The Ryzen AI 9 HX PRO 370 is manufactured by AMD. It was released in 6 January 2025 (less than a year ago). It is based on the Strix Point-HX PRO (Zen 5/5c) (2025) architecture. It features 12 cores and 24 threads. Base frequency is 2 GHz, with boost up to 5.1 GHz. L3 cache: 16 MB. L2 cache: 1 MB (per core). Built on 4 nm process technology. Socket: FP8. Thermal design power (TDP): 28 Watt. Memory support: DDR5. Passmark benchmark score: 32,841 points.