Xeon W3570 vs Xeon L5609

PassMark CPU Mark evaluates processor speed through complex mathematical computations. It provides a reliable metric to compare multi-core performance, where higher scores indicate faster processing for multitasking, gaming, and heavy workloads.

Performance Comparison

About PassMark

Passmark Score

3267

Passmark Score

3298

Performance Difference

Xeon L5609 is 0.9% faster than Xeon W3570

Benchmarks & Performance Comparison

In this CPU comparison, Xeon L5609 performs 0.9% better in benchmarks. Below you'll find detailed performance analysis, gaming benchmarks, power consumption data, and specifications to help you decide between Xeon W3570 and Xeon L5609.

Both processors are popular choices for gaming PCs. Consider factors like core count, boost clock speeds, power consumption (TDP), and gaming vs productivity performance when choosing between these CPUs.

Technical Specifications

Detailed hardware specifications for Xeon W3570 and Xeon L5609

Xeon W3570

The Xeon W3570 is manufactured by Intel. It was released in 30 March 2009 (16 years ago). It is based on the Bloomfield (2008−2010) architecture. It features 4 cores and 8 threads. Base frequency is 3.2 GHz, with boost up to 3.46 GHz. L3 cache: 8 MB (total). L2 cache: 256 kB (per core). Built on 45 nm process technology. Socket: LGA1366. Thermal design power (TDP): 130 Watt. Memory support: DDR3. Passmark benchmark score: 3,267 points. Launch price was $480.

General Information

Type:server

Designer:Intel

Launch Price:$480

Manufacturer:Intel

Release Date:30 March 2009 (16 years ago)

Architecture Codename:Bloomfield (2008−2010)

Performance Ranking Position:2172

Technical Specifications

Cores:4

Threads:8

Die Size:263 mm2

L1 Cache:64 kB (per core)

L2 Cache:256 kB (per core)

L3 Cache:8 MB (total)

Max Frequency:3.46 GHz

64-Bit Support:+

Base Frequency:3.2 GHz

Transistor Count:731 million

Process Technology:45 nm

Max Core Temperature:68 °C

Compatibilidade Com Windows 11:-

Compatibility

Socket:LGA1366

Power Consumption (TDP):130 Watt

Max Processors In Config:1

Memory

RAM Types:DDR3

Memory Channels:3

Memory Bandwidth:32 GB/s

ECC Memory Support:+

Max Memory Capacity:24 GB

Xeon L5609

The Xeon L5609 is manufactured by Intel. It was released in 16 March 2010 (15 years ago). It is based on the Westmere-EP (2010−2011) architecture. It features 4 cores and 4 threads. Base frequency is 1.86 GHz, with boost up to 1.86 GHz. L3 cache: 12 MB (total). L2 cache: 256 kB (per core). Built on 32 nm process technology. Socket: LGA1366. Thermal design power (TDP): 40 Watt. Memory support: DDR3. Passmark benchmark score: 3,298 points.