Xeon Platinum 8168 vs Ryzen AI 9 HX PRO 370

PassMark CPU Mark evaluates processor speed through complex mathematical computations. It provides a reliable metric to compare multi-core performance, where higher scores indicate faster processing for multitasking, gaming, and heavy workloads.

Performance Comparison

About PassMark

Passmark Score

32373

Passmark Score

32841

Performance Difference

Ryzen AI 9 HX PRO 370 is 1.4% faster than Xeon Platinum 8168

Benchmarks & Performance Comparison

In this CPU comparison, Ryzen AI 9 HX PRO 370 performs 1.4% better in benchmarks. Below you'll find detailed performance analysis, gaming benchmarks, power consumption data, and specifications to help you decide between Xeon Platinum 8168 and Ryzen AI 9 HX PRO 370.

Both processors are popular choices for gaming PCs. Consider factors like core count, boost clock speeds, power consumption (TDP), and gaming vs productivity performance when choosing between these CPUs.

Technical Specifications

Detailed hardware specifications for Xeon Platinum 8168 and Ryzen AI 9 HX PRO 370

Xeon Platinum 8168

The Xeon Platinum 8168 is manufactured by Intel. It was released in 25 April 2017 (8 years ago). It is based on the Skylake (server) (2017−2018) architecture. It features 24 cores and 48 threads. Base frequency is 2.7 GHz, with boost up to 3.7 GHz. L3 cache: 33 MB. L2 cache: 24 MB. Built on 14 nm process technology. Socket: LGA3647. Thermal design power (TDP): 205 Watt. Memory support: DDR4-2666. Passmark benchmark score: 32,373 points. Launch price was $5,890.

General Information

Type:server

Series:Intel Xeon Platinum

Designer:Intel

Launch Price:$5,890

Release Date:25 April 2017 (8 years ago)

Architecture Codename:Skylake (server) (2017−2018)

Performance Ranking Position:382

Technical Specifications

Cores:24

Threads:48

L1 Cache:1.5 MB

L2 Cache:24 MB

L3 Cache:33 MB

Max Frequency:3.7 GHz

Multiplicador:27

64-Bit Support:+

Base Frequency:2.7 GHz

Process Technology:14 nm

Max Core Temperature:85 °C

Compatibilidade Com Windows 11:+

Compatibility

Socket:LGA3647

Power Consumption (TDP):205 Watt

Max Processors In Config:8 (Multiprocessor)

Memory

RAM Types:DDR4-2666

Memory Channels:6

Memory Bandwidth:128.001 GB/s

ECC Memory Support:+

Max Memory Capacity:768 GB

Ryzen AI 9 HX PRO 370

The Ryzen AI 9 HX PRO 370 is manufactured by AMD. It was released in 6 January 2025 (less than a year ago). It is based on the Strix Point-HX PRO (Zen 5/5c) (2025) architecture. It features 12 cores and 24 threads. Base frequency is 2 GHz, with boost up to 5.1 GHz. L3 cache: 16 MB. L2 cache: 1 MB (per core). Built on 4 nm process technology. Socket: FP8. Thermal design power (TDP): 28 Watt. Memory support: DDR5. Passmark benchmark score: 32,841 points.