Xeon Gold 5318Y vs Ryzen AI 9 HX PRO 370

PassMark CPU Mark evaluates processor speed through complex mathematical computations. It provides a reliable metric to compare multi-core performance, where higher scores indicate faster processing for multitasking, gaming, and heavy workloads.

Performance Comparison

About PassMark

Passmark Score

33139

Passmark Score

32841

Performance Difference

Xeon Gold 5318Y is 0.9% faster than Ryzen AI 9 HX PRO 370

Benchmarks & Performance Comparison

In this CPU comparison, Xeon Gold 5318Y performs 0.9% better in benchmarks. Below you'll find detailed performance analysis, gaming benchmarks, power consumption data, and specifications to help you decide between Xeon Gold 5318Y and Ryzen AI 9 HX PRO 370.

Both processors are popular choices for gaming PCs. Consider factors like core count, boost clock speeds, power consumption (TDP), and gaming vs productivity performance when choosing between these CPUs.

Technical Specifications

Detailed hardware specifications for Xeon Gold 5318Y and Ryzen AI 9 HX PRO 370

Xeon Gold 5318Y

The Xeon Gold 5318Y is manufactured by Intel. It was released in 6 April 2021 (4 years ago). It is based on the Ice Lake-SP (2021) architecture. It features 24 cores and 48 threads. Base frequency is 2.1 GHz, with boost up to 3.4 GHz. L3 cache: 36 MB (total). L2 cache: 1 MB (per core). Built on 10 nm process technology. Socket: LGA4189. Thermal design power (TDP): 165 Watt. Memory support: DDR4-2933. Passmark benchmark score: 33,139 points.

General Information

Type:server

Designer:Intel

Manufacturer:Intel

Release Date:6 April 2021 (4 years ago)

Architecture Codename:Ice Lake-SP (2021)

Performance Ranking Position:369

Technical Specifications

Cores:24

Threads:48

L1 Cache:64K (per core)

L2 Cache:1 MB (per core)

L3 Cache:36 MB (total)

Max Frequency:3.4 GHz

64-Bit Support:+

Base Frequency:2.1 GHz

Process Technology:10 nm

Max Case Temperature (TCase):87 °C

Compatibilidade Com Windows 11:+

Compatibility

Socket:LGA4189

Power Consumption (TDP):165 Watt

Max Processors In Config:2

Memory

RAM Types:DDR4-2933

Memory Channels:8

ECC Memory Support:+

Max Memory Capacity:6 TB

Ryzen AI 9 HX PRO 370

The Ryzen AI 9 HX PRO 370 is manufactured by AMD. It was released in 6 January 2025 (less than a year ago). It is based on the Strix Point-HX PRO (Zen 5/5c) (2025) architecture. It features 12 cores and 24 threads. Base frequency is 2 GHz, with boost up to 5.1 GHz. L3 cache: 16 MB. L2 cache: 1 MB (per core). Built on 4 nm process technology. Socket: FP8. Thermal design power (TDP): 28 Watt. Memory support: DDR5. Passmark benchmark score: 32,841 points.