Ryzen AI 9 HX PRO 375
AMD
PassMark
33,619
Performance Spectrum - CPU
About PassMark
PassMark CPU Mark evaluates processor speed through complex mathematical computations. It provides a reliable metric to compare multi-core performance, where higher scores indicate faster processing for multitasking, gaming, and heavy workloads.
Overview
The Ryzen AI 9 HX PRO 375 is manufactured by AMD. It was released in 6 January 2025 (less than a year ago). It is based on the Strix Point (2024−2025) architecture. It features 12 cores and 24 threads. Base frequency is 2 GHz, with boost up to 5.1 GHz. L3 cache: 16 MB. L2 cache: 1 MB (per core). Built on 4 nm process technology. Socket: FP8. Thermal design power (TDP): 28 Watt. Memory support: DDR5. Passmark benchmark score: 33,619 points. Launch price was $499.
Value Upgrade Path
This is the official ChipVERSUS Value Rating, comparing raw performance (PassMark) per dollar. Components placed above yours deliver better value for money.
Avg price is the current average price collected from markets across the web.
Performance Per Dollar
FPS Benchmarks
Predicted performance for Ryzen AI 9 HX PRO 375 across popular games. Tested paired with RTX 4090 to isolate CPU performance.
Among Us
Call of Duty: Black Ops 6
Counter-Strike 2
Cyberpunk 2077
Destiny 2
Euro Truck Simulator 2
League of Legends
Left 4 Dead 2
Overwatch 2
Path of Exile 2
Technical Analysis
Detailed breakdown of Ryzen AI 9 HX PRO 375 specifications and capabilities.
Processing Power
The Ryzen AI 9 HX PRO 375 is a 12-core / 24-thread processor based on the Strix Point (2024−2025) architecture, manufactured on a 4 nm process node. It reaches a maximum boost clock of 5.1 GHz from a base frequency of 2 GHz— higher boost clocks directly translate to better single-threaded performance and responsiveness in gaming. It carries 16 MB of L3 cache, plus 1 MB (per core) of L2 cache and 80 kB (per core) of L1 cache per core. In the PassMark benchmark (a comprehensive multi-threaded test), it scores 33,619, placing it in the High-End performance tier as a Current Gen generation product. Geekbench 6 single-core (the most relevant metric for gaming FPS) records 2,864, while multi-core reaches 15,012. Cinebench R23 multi-core (measuring sustained rendering workload performance) scores 22,246.
| Specification | Ryzen AI 9 HX PRO 375 |
|---|---|
| Cores / ThreadsPhysical/logical processing units | 12C / 24T |
| Max Boost ClockPeak single-core speed under boost | 5.1 GHz |
| Base ClockGuaranteed minimum operating frequency | 2 GHz |
| ArchitectureCPU microarchitecture design | Strix Point (2024−2025) |
| Process NodeFabrication technology — smaller = more efficient | 4 nm |
| L3 CacheShared cache — reduces memory latency for all cores | 16 MB |
| L2 CachePer-core fast cache for frequently accessed data | 1 MB (per core) |
| L1 CacheUltra-fast per-core cache | 80 kB (per core) |
| Die SizePhysical silicon area of the processor | 233 mm2 |
| Max TemperatureMaximum safe operating temperature (Tjmax) | 100 °C |
| 64-bit Support | Yes |
| PassMark ScoreOverall multi-threaded benchmark score | 33,619 |
| Cinebench R23 MultiSustained multi-core rendering performance | 22,246 |
| Geekbench 6 SingleSingle-core performance — most relevant for gaming | 2,864 |
| Geekbench 6 MultiMulti-core parallel workload performance | 15,012 |
Memory & Platform
The Ryzen AI 9 HX PRO 375 fits into the FP8 socket and supports PCIe 4.0 with 16 total PCIe lanes for expansion cards and storage. It supports DDR5 memory at speeds up to LPDDR5x-8000 (faster RAM improves bandwidth-sensitive workloads), with a maximum capacity of 256 GB across 2 channels (dual-channel doubles bandwidth). It supports ECC memory, providing error-correcting capabilities — essential for mission-critical workloads and servers. Integrated graphics: Radeon 890M — allows display output without a dedicated GPU, useful for troubleshooting and light tasks.
| Specification | Ryzen AI 9 HX PRO 375 |
|---|---|
| TypeDesktop or Laptop processor | Laptop |
| SocketMotherboard socket required | FP8 |
| PCIe GenerationPeripheral interconnect speed — affects GPU and SSD bandwidth | PCIe 4.0 |
| PCIe LanesTotal available lanes for GPUs, NVMe drives, and expansion | 16 |
| RAM TypeSupported memory standard | DDR5 |
| Max RAM SpeedMaximum officially supported memory frequency | LPDDR5x-8000 |
| Max RAM CapacityMaximum installable memory | 256 GB |
| RAM ChannelsDual-channel doubles bandwidth vs single-channel | 2 |
| ECC SupportError-Correcting Code memory — prevents data corruption | Yes |
| Integrated GPUBuilt-in graphics processor | Radeon 890M |
| Compatible ChipsetsMotherboard chipsets that support this CPU | FP8,FP7 |
| Max CPUs in ConfigMulti-socket support for servers | 1 |
Advanced Features
The Ryzen AI 9 HX PRO 375 is primarily designed for Mobile Workstation / High-end Gaming. It features an unlocked multiplier, allowing enthusiasts to overclock beyond stock frequencies for additional performance. It supports AVX-512 instructions — specialized SIMD operations that significantly accelerate AI inference, scientific computing, and video encoding workloads. Virtualization: AMD-V, IOMMU — enables running virtual machines efficiently (important for development and server workloads). Its primary market competitor is the Core i9-14900HX.
| Specification | Ryzen AI 9 HX PRO 375 |
|---|---|
| Primary Use CaseIntended workload category | Mobile Workstation / High-end Gaming |
| OverclockingWhether CPU clock can be manually increased | ✅ Unlocked |
| AVX-512Advanced vector instructions for AI/ML workloads | ✅ Supported |
| VirtualizationHardware-assisted virtualization technology | AMD-V, IOMMU |
| Direct CompetitorMarket equivalent from rival manufacturer | Core i9-14900HX |
Power & Cooling
The Ryzen AI 9 HX PRO 375 has a rated TDP (Thermal Design Power) of 28 Watt — this indicates the amount of heat generated under sustained load and determines what cooling solution is needed. It ships with the Laptop Integrated stock cooler. Recommended cooling: High-end Laptop Cooling.
| Specification | Ryzen AI 9 HX PRO 375 |
|---|---|
| TDPThermal Design Power — heat output under sustained workload | 28 Watt |
| Max TemperatureMaximum safe junction temperature (Tjmax) | 100 °C |
| Included CoolerStock cooler bundled in the box | Laptop Integrated |
| Recommended CoolerSuggested aftermarket cooling solution | High-end Laptop Cooling |
Value Analysis
Performance ranking position: #363 out of all indexed processors.
| Specification | Ryzen AI 9 HX PRO 375 |
|---|---|
| MSRPManufacturer's Suggested Retail Price | $0 |
| Avg Price (30d)Average market price over the last 30 days | $0 |
| Launch PriceOriginal retail price at launch | $499 |
| Performance RankPosition in overall performance ranking | #363 |
| Release DateLaunch date | 6 January 2025 (less than a year ago) |
| Release Year | 2025 |
| DesignerArchitecture designer (e.g. Intel, AMD) | AMD |
| ManufacturerFabrication foundry (e.g. TSMC) | TSMC |
Similar Performance
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Our Recommendation for Ryzen AI 9 HX PRO 375
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High-End (Max Performance) (12)
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