Xeon X5570 vs Ryzen Embedded R1600

PassMark CPU Mark evaluates processor speed through complex mathematical computations. It provides a reliable metric to compare multi-core performance, where higher scores indicate faster processing for multitasking, gaming, and heavy workloads.

Performance Comparison

About PassMark

Passmark Score

3306

Passmark Score

3276

Performance Difference

Xeon X5570 is 0.9% faster than Ryzen Embedded R1600

Benchmarks & Performance Comparison

In this CPU comparison, Xeon X5570 performs 0.9% better in benchmarks. Below you'll find detailed performance analysis, gaming benchmarks, power consumption data, and specifications to help you decide between Xeon X5570 and Ryzen Embedded R1600.

Both processors are popular choices for gaming PCs. Consider factors like core count, boost clock speeds, power consumption (TDP), and gaming vs productivity performance when choosing between these CPUs.

Technical Specifications

Detailed hardware specifications for Xeon X5570 and Ryzen Embedded R1600

Xeon X5570

The Xeon X5570 is manufactured by Intel. It was released in 30 March 2009 (16 years ago). It is based on the Gainestown (2009−2010) architecture. It features 4 cores and 8 threads. Base frequency is 2.93 GHz, with boost up to 3.33 GHz. L3 cache: 8 MB (total). L2 cache: 256 kB (per core). Built on 45 nm process technology. Socket: LGA1366. Thermal design power (TDP): 95 Watt. Memory support: DDR3. Passmark benchmark score: 3,306 points. Launch price was $49.

General Information

Type:server

Designer:Intel

Launch Price:$49

Manufacturer:Intel

Release Date:30 March 2009 (16 years ago)

Architecture Codename:Gainestown (2009−2010)

Performance Ranking Position:2160

Technical Specifications

Cores:4

Threads:8

Die Size:263 mm2

L1 Cache:64 kB (per core)

L2 Cache:256 kB (per core)

L3 Cache:8 MB (total)

Max Frequency:3.33 GHz

64-Bit Support:+

Base Frequency:2.93 GHz

Transistor Count:731 million

Process Technology:45 nm

Max Core Temperature:75 °C

Compatibilidade Com Windows 11:-

Compatibility

Socket:LGA1366

Power Consumption (TDP):95 Watt

Max Processors In Config:2

Memory

RAM Types:DDR3

Memory Channels:3

Memory Bandwidth:32 GB/s

ECC Memory Support:+

Max Memory Capacity:144 GB

Ryzen Embedded R1600

The Ryzen Embedded R1600 is manufactured by AMD. It was released in 25 February 2020 (5 years ago). It is based on the Zen (2017−2020) architecture. It features 2 cores and 4 threads. Base frequency is 2.6 GHz, with boost up to 3.1 GHz. L3 cache: 4 MB (total). L2 cache: 512 kB (per core). Built on 14 nm process technology. Socket: FP5. Thermal design power (TDP): 25 Watt. Memory support: DDR4-2400. Passmark benchmark score: 3,276 points.