Ryzen 7 3700U vs Xeon X5690

PassMark CPU Mark evaluates processor speed through complex mathematical computations. It provides a reliable metric to compare multi-core performance, where higher scores indicate faster processing for multitasking, gaming, and heavy workloads.

Performance Comparison

About PassMark

Passmark Score

7049

Passmark Score

7031

Performance Difference

Ryzen 7 3700U is 0.3% faster than Xeon X5690

Benchmarks & Performance Comparison

In this CPU comparison, Ryzen 7 3700U performs 0.3% better in benchmarks. Below you'll find detailed performance analysis, gaming benchmarks, power consumption data, and specifications to help you decide between Ryzen 7 3700U and Xeon X5690.

Both processors are popular choices for gaming PCs. Consider factors like core count, boost clock speeds, power consumption (TDP), and gaming vs productivity performance when choosing between these CPUs.

Technical Specifications

Detailed hardware specifications for Ryzen 7 3700U and Xeon X5690

Ryzen 7 3700U

The Ryzen 7 3700U is manufactured by AMD. It was released in 6 January 2019 (6 years ago). It is based on the Picasso-U (Zen+) (2019−2020) architecture. It features 4 cores and 8 threads. Base frequency is 2.3 GHz, with boost up to 4 GHz. L3 cache: 4 MB (total). L2 cache: 512K (per core). Built on 12 nm process technology. Socket: FP5. Thermal design power (TDP): 15 Watt. Memory support: DDR4. Passmark benchmark score: 7,049 points.

General Information

Type:Para notebooks

Series:AMD Ryzen 7

Designer:AMD

Manufacturer:GlobalFoundries

Release Date:6 January 2019 (6 years ago)

Architecture Codename:Picasso-U (Zen+) (2019−2020)

Performance Ranking Position:1572

Technical Specifications

Cores:4

Threads:8

Die Size:209.78 mm2

L1 Cache:128K (per core)

L2 Cache:512K (per core)

L3 Cache:4 MB (total)

Max Frequency:4 GHz

Multiplicador:23

64-Bit Support:+

Base Frequency:2.3 GHz

Transistor Count:4940 Million

Type De Autocarro:PCIe 3.0

Process Technology:12 nm

Max Core Temperature:105 °C

Compatibilidade Com Windows 11:+

Compatibility

Socket:FP5

Power Consumption (TDP):15 Watt

Max Processors In Config:1 (Uniprocessor)

Memory

RAM Types:DDR4

Memory Channels:2

Memory Bandwidth:38.397 GB/s

ECC Memory Support:+

Max Memory Capacity:64 GB

Xeon X5690

The Xeon X5690 is manufactured by Intel. It was released in 14 February 2011 (14 years ago). It is based on the Westmere-EP (2010−2011) architecture. It features 6 cores and 12 threads. Base frequency is 3.46 GHz, with boost up to 3.73 GHz. L3 cache: 12288 kB (total). L2 cache: 256 kB (per core). Built on 32 nm process technology. Socket: LGA1366. Thermal design power (TDP): 130 Watt. Memory support: DDR3. Passmark benchmark score: 7,031 points. Launch price was $205.