Ryzen 3 PRO 8300GE vs Ryzen 7 7445HS

Performance Spectrum - CPU

About PassMark

PassMark CPU Mark evaluates processor speed through complex mathematical computations. It provides a reliable metric to compare multi-core performance, where higher scores indicate faster processing for multitasking, gaming, and heavy workloads.

Performance Comparison

About PassMark

Passmark Score

18945

Passmark Score

19008

Performance Difference

Ryzen 7 7445HS is 0.3% faster than Ryzen 3 PRO 8300GE

Benchmarks & Performance Comparison

In this CPU comparison, Ryzen 7 7445HS performs 0.3% better in benchmarks. Below you'll find detailed performance analysis, gaming benchmarks, power consumption data, and specifications to help you decide between Ryzen 3 PRO 8300GE and Ryzen 7 7445HS.

Both processors are popular choices for gaming PCs. Consider factors like core count, boost clock speeds, power consumption (TDP), and gaming vs productivity performance when choosing between these CPUs.

Technical Specifications

Detailed hardware specifications for Ryzen 3 PRO 8300GE and Ryzen 7 7445HS

AMD

Ryzen 3 PRO 8300GE

The Ryzen 3 PRO 8300GE is manufactured by AMD. Passmark benchmark score: 18,945 points.

General Information

Technical Specifications

Compatibility

Memory

AMD

Ryzen 7 7445HS

The Ryzen 7 7445HS is manufactured by AMD. It was released in 3 May 2023 (2 years ago). It is based on the Phoenix (2023−2024) architecture. It features 6 cores and 12 threads. Base frequency is 3.2 GHz, with boost up to 4.7 GHz. L3 cache: 16 MB. L2 cache: 6 MB. Built on 4 nm process technology. Socket: FP7/FP7r2. Thermal design power (TDP): 35 Watt. Passmark benchmark score: 19,008 points.

General Information

Type:Para notebooks
Series:Ryzen 7000 Series
Designer:AMD
Release Date:3 May 2023 (2 years ago)
Architecture Codename:Phoenix (2023−2024)
Performance Ranking Position:822

Technical Specifications

Cores:6
Threads:12
Die Size:137 mm2
L2 Cache:6 MB
L3 Cache:16 MB
Max Frequency:4.7 GHz
64-Bit Support:+
Base Frequency:3.2 GHz
Process Technology:4 nm
Max Core Temperature:100 °C

Compatibility

Socket:FP7/FP7r2
Power Consumption (TDP):35 Watt

Memory

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