Xeon Platinum 8270 vs Ryzen AI 9 HX PRO 370

PassMark CPU Mark evaluates processor speed through complex mathematical computations. It provides a reliable metric to compare multi-core performance, where higher scores indicate faster processing for multitasking, gaming, and heavy workloads.

Performance Comparison

About PassMark

Passmark Score

33602

Passmark Score

32841

Performance Difference

Xeon Platinum 8270 is 2.3% faster than Ryzen AI 9 HX PRO 370

Benchmarks & Performance Comparison

In this CPU comparison, Xeon Platinum 8270 performs 2.3% better in benchmarks. Below you'll find detailed performance analysis, gaming benchmarks, power consumption data, and specifications to help you decide between Xeon Platinum 8270 and Ryzen AI 9 HX PRO 370.

Both processors are popular choices for gaming PCs. Consider factors like core count, boost clock speeds, power consumption (TDP), and gaming vs productivity performance when choosing between these CPUs.

Technical Specifications

Detailed hardware specifications for Xeon Platinum 8270 and Ryzen AI 9 HX PRO 370

Xeon Platinum 8270

The Xeon Platinum 8270 is manufactured by Intel. It was released in 11 December 2018 (6 years ago). It is based on the Cascade Lake-SP (2018) architecture. It features 26 cores and 52 threads. Base frequency is 2.7 GHz, with boost up to 4 GHz. L3 cache: 35.75 MB (total). L2 cache: 1 MB (per core). Built on 14 nm process technology. Socket: LGA3647. Thermal design power (TDP): 205 Watt. Memory support: DDR4-2933. Passmark benchmark score: 33,602 points. Launch price was $7,405.

General Information

Type:server

Series:Intel Xeon Platinum

Designer:Intel

Launch Price:$7,405

Manufacturer:Intel

Release Date:11 December 2018 (6 years ago)

Architecture Codename:Cascade Lake-SP (2018)

Performance Ranking Position:364

Technical Specifications

Cores:26

Threads:52

L1 Cache:64 kB (per core)

L2 Cache:1 MB (per core)

L3 Cache:35.75 MB (total)

Max Frequency:4 GHz

Multiplicador:27

64-Bit Support:+

Base Frequency:2.7 GHz

Transistor Count:8,000 million

Process Technology:14 nm

Max Core Temperature:84 °C

Compatibilidade Com Windows 11:+

Compatibility

Socket:LGA3647

Power Consumption (TDP):205 Watt

Max Processors In Config:8 (Multiprocessor)

Memory

RAM Types:DDR4-2933

Memory Channels:6

Memory Bandwidth:140.8 GB/s

ECC Memory Support:+

Max Memory Capacity:1 TB

Ryzen AI 9 HX PRO 370

The Ryzen AI 9 HX PRO 370 is manufactured by AMD. It was released in 6 January 2025 (less than a year ago). It is based on the Strix Point-HX PRO (Zen 5/5c) (2025) architecture. It features 12 cores and 24 threads. Base frequency is 2 GHz, with boost up to 5.1 GHz. L3 cache: 16 MB. L2 cache: 1 MB (per core). Built on 4 nm process technology. Socket: FP8. Thermal design power (TDP): 28 Watt. Memory support: DDR5. Passmark benchmark score: 32,841 points.